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Heatsinks

MARK-TRONIK GmbH
Rahmedestr. 75
D-58762 Altena
GERMANY

Phone +49 23 52 - 95 99 0
Fax +49 23 52 - 95 99 20

Heat sinks

                     
Standard profiles   Profile heatsinks   High-performance heatsinks   Modular high-performance heatsinks   Fingres heatsinks   Printed circuit board heatsinks
                     
Standard profiles   Profile
heatsinks
  High-performance
heatsinks
  Modular
high-performance

heatsinks
  Fingres
heatsinks
  Printed circuit board heatsinks

The turbulent developement in the area of electrical equipment demands more and more innovations. One line of work are heatsinks to reduce the heat of any kind of power ampifier. But therer are physical limits to conventional heat sinks regarding the maximum of heat conduction.

So we added a new line of modular high-performance heatsinks to our product range. The modular structure makes an exact fit of the cooling surface to the heatproducing object possible. Furthermore the aluminium surface can be fimished by all current galvanic processes and by that change it's cooling characteristics.

Basically the modular high-performance heatsinks consist of single rips of aluminium, which can be cold welded together in variable width. So the flexibility in planing now no longer only contains one dimension (length) but two dimensions (length and width). With a maximal rip length of 174 mm we offer our customers enough room to counter any heat strain. With the help of ventilation the effincency con be even improved.

The modular high-performance heatsinks can be used in pretty much every line of industry. Because we don't use any adhesives in connecting the modules, they can be used even for cooling engines with strong vibrations. Another argument for using modular high-performance heatsinks is the good cost effectiveness. Our customers alway get the optimal heat sink for their requirements.